Changes between Version 16 and Version 17 of faq


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Timestamp:
07/09/2018 03:38:59 PM (2 months ago)
Author:
Ron Eisworth
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  • faq

    v16 v17  
    140140Heat is related to power. The more power the board draws, the more heat that must be dissipated.
    141141
    142 The number one item that will be warm is the CPU. CPUs from Gateworks should all be equipped with a heatsink.
    143 
    144 Some customers choose to use a fan but it is not required.
    145 
    146 The Gateworks boards are rated from -40 to +85C (some processors are even higher) so this allows the boards to operate at hotter temperatures than one might expect.
     142The number one item that will be warm is the CPU. CPUs from Gateworks should all be equipped with a heatsink and depending on the CPU speed a fansink may be required.
     143
     144Gateworks boards use components that are rated from -40 to +85C and higher (for example most CPU's and powersupply components have higher temp ratings). Note the +85C is the max rating for the component temperature which specifies the max temperature the component is guaranteed to work. The max ambient temperature for the overall product will be lower and is dependent on the effectiveness of the cooling solution used (enclosure, airflow, heatsinks, etc...).   
    147145
    148146The second item that will be warm will be any wireless radios that may be used. These typically consume a lot of power and thus will become warm.
    149147
    150 Another item that is warm may be the PCIe switch (only available on certain boards). The typical power usage
     148Another item that is warm may be the PCIe switch (used on certain boards). The typical power usage
    151149is appx 1.35W up to a max of appx 2.6W (max being 85% traffic). The switch does support PCIExpress Active State Power Management (ASPM)and also will power down unused !SerDes lanes automatically to reduce power when possible. Some customers choose to place a heatsink on the PLX PCIe switch chip.
    152150
     
    155153To summarize:
    156154 * Heat is a direct relationship with power consumption
    157  * Heatsink the CPU to a metal enclosure for better heat dissipation
     155 * Heatsink the CPU to a metal enclosure for better heat dissipation and/or use airflow
    158156 * Add a heatsink to the PCIe switch chip if desired
    159  * Add a fan to dissipate the heat and avoid hotspots - use a fan to blow air over the board and radios to help cool them. This can be very effective even in an closed outdoor enclosure. Gateworks sells an outdoor enclosure in which there is a small fan which circulates the air inside to help even out any hot spots on the CPU and radios. This fan alone typically lowers the CPU temp by around 15C. [http://shop.gateworks.com/index.php?route=product/category&path=76_78 Outdoor Enclosure]
     157 * Add a fan to dissipate the heat and avoid hotspots - use a fan to blow air over the board and radios to help cool them. This can be very effective even in a sealed outdoor enclosure. Gateworks sells an outdoor enclosure in which there is a small fan which circulates the air inside to help even out any hot spots on the CPU and radios. This fan alone typically lowers the CPU temp by around 15C. [http://shop.gateworks.com/index.php?route=product/category&path=76_78 Outdoor Enclosure]
    160158 * It is possible to couple the radios to the enclosure. For doing this thermal pad material can be used. The thermal pad is applied to the top of the radio and the board is mounted so this pad then makes contact with the side of the enclosure. The pads are available in a variety of thicknesses which allows you to optimize it for your enclosure mounting. Here is a link for an example of the type of thermal pad that customers often use:
    161159  * [http://www.digikey.com/product-detail/en/A15959-10/926-1131-ND/2445429]