Changes between Version 19 and Version 20 of newport/powerthermal


Ignore:
Timestamp:
06/09/2020 05:26:41 PM (5 months ago)
Author:
Ron Eisworth
Comment:

Added package size

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  • newport/powerthermal

    v19 v20  
    2121The thermal resistances for the BGA676 and BGA555 packages is given below:
    2222
    23 * BGA676 Package - GW63xx/GW64xx
     23* BGA676 Package (27mm x 27mm) - GW63xx/GW64xx
    2424 * θJC (junction to case) = 0.45°C/W
    2525 * θJB (junction to board) = 3.29°C/W
    2626
    27 * BGA555 Package - GW61xx/GW62xx
     27* BGA555 Package (21mm x 21mm) - GW61xx/GW62xx
    2828 * θJC (junction to case) = 0.65°C/W
    2929 * θJB (junction to board) = 3.52°C/W