Changes between Version 2 and Version 3 of ventana/thermal


Ignore:
Timestamp:
01/02/2018 09:03:14 AM (4 months ago)
Author:
Ron Eisworth
Comment:

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  • ventana/thermal

    v2 v3  
    120120'''PCIe Switch'''
    121121
    122 Besides the CPU, another item that generates significant heat is the PCIe switch (PLX PEX860x) used on some of the Ventana models (GW520x, GW53xx, GW54xx, GW552x). The typical power usage is appx 1.35W up to a max of appx 2.35W (max being 85% traffic). The switch does support PCIExpress Active State Power Management (ASPM)and also will power down unused SerDes lanes automatically to reduce power when possible.
     122Besides the CPU, another item that generates significant heat is the PCIe switch (PLX PEX860x) used on some of the Ventana models (GW520x, GW53xx, GW54xx, GW552x). The typical power usage is appx 1.35W up to a max of appx 2.35W (max being 85% traffic, Gen 1 operation). The switch does support PCIExpress Active State Power Management (ASPM) and also will power down unused SerDes lanes automatically to reduce power when possible.
    123123
    124124The part is rated as follows:
    125 Max Operating Junction Temp for Reliability = 125C
    126 ThetaJC = 6.12C/W
    127 On the GW54xx board there are topside Mini-PCIe sockets which when used will be directly over the switch. For cases that require the use of these sites, it is recommended to use additional heatsinking or air cooling to keep the switch within the operating temperature range.
     125
     126 * Max Operating Junction Temp for Reliability = 125C
     127 * ThetaJC = 6.12C/W
     128
     129On the GW54xx boards there are topside Mini-PCIe sockets which when used will be directly over the switch. For cases that require the use of these sites, it is recommended to use additional heatsinking or air cooling to keep the switch within the operating temperature range.
    128130
    129131For low profile heatsinking, Panasonic makes graphite thermal sheets that can be attached to the device and then can extend out and over to the CPU or another area where a larger heatsink can be located. See the following link for information on this material: ​https://industrial.panasonic.com/ww/pgs2/mlpgs (available at Digikey as well).