Changes between Version 1 and Version 2 of ventana/thermal

Timestamp:

01/02/2018 04:47:23 PM (7 years ago)

Author:

Ron Eisworth

Comment:

Added PCIe Switch Info

ventana/thermal

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+'''PCIe Switch'''
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+Besides the CPU, another item that generates significant heat is the PCIe switch (PLX PEX860x) used on some of the Ventana models (GW520x, GW53xx, GW54xx, GW552x). The typical power usage is appx 1.35W up to a max of appx 2.35W (max being 85% traffic). The switch does support PCIExpress Active State Power Management (ASPM)and also will power down unused SerDes lanes automatically to reduce power when possible.
+
+The part is rated as follows:
+Max Operating Junction Temp for Reliability = 125C
+ThetaJC = 6.12C/W
+On the GW54xx board there are topside Mini-PCIe sockets which when used will be directly over the switch. For cases that require the use of these sites, it is recommended to use additional heatsinking or air cooling to keep the switch within the operating temperature range.
+
+For low profile heatsinking, Panasonic makes graphite thermal sheets that can be attached to the device and then can extend out and over to the CPU or another area where a larger heatsink can be located. See the following link for information on this material: ​https://industrial.panasonic.com/ww/pgs2/mlpgs (available at Digikey as well).
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