| | 127 | == Custom Enclosure Guidelines |
| | 128 | * Metal enclosures are typically recommended due to better EMI shielding, etc compared to plastic. |
| | 129 | * It is recommended to heatsink the CPU to the outer edge of the enclosure |
| | 130 | * It is possible to use thermal pads on both sides of the heat slug between the CPU and the enclosure, each having a max compression of 63%. While less thermally efficient than using paste on one side and a pad on the other, using pads on both sides was more forgiving of tolerances and provided sufficient thermal dissipation. |
| | 131 | * For hetasink forces, a general rule of thumb is a maximum pressure / force of 59 gm-f per square mm of solderable pad area. (reference sec 8.1 [https://www.nxp.com/docs/en/application-note/AN13656.pdf NXP AN13656.pdf] |
| | 132 | * For EMI purposes, it is recommended for the metal tangs of the RJ45 ethernet jacks to make constant contact with the metal enclosure |
| | 133 | |
