Changes between Version 36 and Version 37 of enclosures


Ignore:
Timestamp:
09/25/2026 07:36:29 PM (2 hours ago)
Author:
Ryan Erb
Comment:

update numbers

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  • enclosures

    v36 v37  
    129129 * It is recommended to heatsink the CPU to the outer edge of the enclosure
    130130 * It is possible to use thermal pads on both sides of the heat slug between the CPU and the enclosure, each having a max compression of 63%. While less thermally efficient than using paste on one side and a pad on the other, using pads on both sides was more forgiving of tolerances and provided sufficient thermal dissipation.
    131  * For hetasink forces, a general rule of thumb is a maximum pressure / force of 59 gm-f per square mm of solderable pad area. (reference sec 8.1 [https://www.nxp.com/docs/en/application-note/AN13656.pdf  NXP AN13656.pdf]
    132131 * For EMI purposes, it is recommended for the metal tangs of the RJ45 ethernet jacks to make constant contact with the metal enclosure
     132 * For hetasink forces, a general rule of thumb is a maximum pressure / force of of solderable pad area:
     133  * 59 gm-f per square mm (The heatsink force for the exposed die for the i.MX8M plus (15x15) package static force)
     134  * i.MX8M Plus (15x15 package) = 3.5 lbs-f max, 3.4 lbs-f recommended (static force)
     135  * i.MX95 (19x19 package) = 10 lbs-f max, 7 lbs-f recommended (static force)
     136  * (reference sec 8.1 [https://www.nxp.com/docs/en/application-note/AN13656.pdf  NXP AN13656.pdf]
    133137