| | 190 | |
| | 191 | === Revision D |
| | 192 | Date: 20234-05-05 |
| | 193 | * Improve ESD & Surge protection |
| | 194 | * Add M2SKT_GDISJ signal to pin 26 (GPIO10) of the M.2 socket to support the 1.8V W_DISABLE2# signal defined for Socket 2 Port Configuration 2 in Table 26 of the M.2 Specification |
| | 195 | * Adjust heatsink height from 15mm to 12mm for compatibility with indoor enclosure |
| | 196 | * Replace GPY111 PHY with TI DP83867 RGMII/SGMII GbE PHY |
| | 197 | * Add optional IEEE1588 time stamp support for the the DP83867 |
| | 198 | * Improve reverse protection diode current capabilities |
| | 199 | * Adjust M.2 socket by making SIM signal capacitors optional, optional reset pullup resistor, pins 56 and pins 58 ground termination resistors, add open drain mosfet control to write protect pin 68 |
| | 200 | * Improve ethernet isolation |
| | 201 | * Move the Type-C SUB connector 0.3mm closer to the board edge for better contact with the mating plug |
| | 202 | * Improve ethernet switch signal routing |
| | 203 | * Improve RGMII emissions |
| | 204 | * Improve PoE current |
